ver: 0.9 jun 21, 2012 tel: 886-3-5788833 http://www.gmt.com.tw 1 G5691 global mixed-mode technology 1.5mhz, 1a high efficiency buck converter features ? input voltage: 2.5v ~5.5v ? high efficiency (95%) ? no schottky diode required ? 1a output current at 5v input 3.3v output ? 1.5mhz switching frequency ? built-in on/off function ? low dropout operation: 100% duty cycle ? thermal protection ? tiny 6-lead tdfn2x2 package ? rohs compliant applications ? mobile phones ? wireless and dsl modems ? power supply for portable devices general description the G5691 provides complete control for a dc/dc converter optimized for high-performance microproc- essor applications. it is operated on current mode ar- chitecture for excellent line and load transient re- sponse. 1.5mhz operation frequency is allowing the use of small surface mount inductor and capacitor. the internal synchronous switch increases efficiency and eliminates the need for an external schottky diode. the G5691 is a family of low-noise synchronous step-down dc/dc converters that is ideally suited for systems powered from a 1-cell li-ion battery or from a 3-cell to 4-cell nicd, nimh, or alkaline battery. it can also be used to usb-based power system. ordering information order number marking output voltage (v) temp. range package (green) G5691rb1u 5691 adjustable -40 c~ +85 c tdfn2x2-6 G5691-12rb1u 5691a 1.2 -40 c~ +85 c tdfn2x2-6 G5691-33rb1u 5691e 3.3 -40 c~ +85 c tdfn2x2-6 note: rb: tdfn2x2-6 1: bonding code u: tape & reel pin configuration typical application circuit tdfn2x2-6 G5691 en nc gnd fb vin lx fb gnd G5691 c in 4.7 f v in 5v 2.2 h c out 10 f v out 3.3v/1a v out = 0.6v (1+ ) r1 r2 1 2 3 6 5 4 thermal pad vin lx en (optional) c fb r1 r2 * * r2= 150k for stability consideration. note: recommend connecting the thermal pad to the ground for excellent power dissipation. 5 3 2 6 4 tdfn2x2-6 G5691 en nc gnd fb vin lx fb gnd G5691 c in 4.7 f v in 5v 2.2 h c out 10 f v out 3.3v/1a v out = 0.6v (1+ ) r1 r2 1 2 3 6 5 4 thermal pad vin lx en (optional) c fb r1 r2 * * r2= 150k for stability consideration. note: recommend connecting the thermal pad to the ground for excellent power dissipation. 5 3 2 6 4
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